chip rc networks design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. gnd gnd gnd gnd discrete chips discrete chips chip rc network (ezact, ezadt, ezast/ss, ezant) chip rc network (ezact, ezadt, ezast/ss, ezant) chip rc network (ezastb/ssb) chip rc network (ezastb/ssb) i/o i/o i/o i/o i/o i/o i/o i/o i/o i/o i/o i/o chip rc networks t ype: ezact ezadt ezast/ss ezant t ype: ezastb/ssb fe atures smallest smd r/c networks 4 popular noise reduction circuits made ezact : 2.0 mm 1.2 mm 0.6 mm, 0.5 mm pitch (flat terminal type) ezadt : 3.2 mm 1.6 mm 0.65 mm, 0.635 mm pitch (concave terminal type) ezast/ss : 4.0 mm 2.1 mm 0.65 mm, 0.8 mm pitch (concave terminal type) ezastb/ssb : 4.0 mm 2.1 mm 0.65 mm, 0.65 mm pitch (convex terminal type) ezant : 6.4 mm 3.1 mm 0.80 mm, 1.27 mm pitch (concave terminal type) t akes up less space than discrete chip resistor & chip capacitor ezact:25 % of 0402 inches (1.0 mm 0.5 mm) chips placing area ezadt:50 % of 0402 inches (1.0 mm 0.5 mm) chips placing area ezast/ss, ezastb/ssb:70 % of 0402 inches (1.0 mm 0.5 mm) chips placing area ezant:55 % of 0805 inches (2.0 mm 1.2 mm) chips placing area rc low pass ? lter ac terminator recommended applications digital equipment such as pcs, printers, hdd, pcmcia cards, pdas, and word processors communication equipment, digital cordless phones, automobile phones, gsm, phs, dect digital audio and video equipment electronic musical instruments, and other digital devices feb. 2006
chip rc networks design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. e 1 z 2 a 3 c 4 t 5 3 6 0 7 a 8 a 9 a 10 j 11 12 10 22 47 100 220 470 1k 0 1 2 3 4 5 6 10 pf 22 pf 0 1 aaa j 5% thick film noise suppression and filtering components standard suffix for special requirement dimension and circuit configuration resistance tolerance design configuration common code r/c standard combination ct 2.0 mm 1.2 mm chip rc networks resistance value configuration capacitance value configuration e 1 z 2 a 3 s 4 s 5 7 6 0 7 1 8 y 9 a 10 j 11 12 ss j ss ct 5% 4.0 mm 2.1 mm nt 6.4 mm 3.1 mm thick film noise suppression and filtering components suffix for special requirement dimension and circuit configuration resistance tolerance design number common code dt 3.2 mm 1.6 mm ct 2 .0mm 1.2 mm chip rc networks resistance value : 10 to 100 k capacitance value : 10 pf to 180 pf in above-mentioned range, it is possible to choose optional r/c. resistance value : 10 to 100 k capacitance value : 10 pf to 33 pf in above-mentioned range, it is possible to choose optional r/c. dt resistance value : 10 to 100 k capacitance value : 10 pf to 100 pf in above-mentioned range, it is possible to choose optional r/c. nt resistance value : 10 to 100 k capacitance value : 220 pf to 1000 pf in above-mentioned range, it is possible to choose optional r/c. e 1 z 2 a 3 s 4 t 5 b 6 3 7 3 8 a 9 a 10 j 11 12 stb 22 47 100 220 470 1k 1 2 3 4 5 6 22 pf 47 pf 100 pf 1 2 3 aa j 5% 4.0 mm 2.1 mm thick film noise suppression and filtering components standard suffix for special requirement dimension and circuit configuration resistance tolerance design configuration common code r/c standard combination convex terminal type chip rc networks resistance value configuration capacitance value configuration e 1 z 2 a 3 s 4 t 5 3 6 3 7 a 8 a 9 a 10 j 11 12 st 22 47 100 220 470 1k 1 2 3 4 5 6 1 2 3 4 5 6 aaa j 5% 4.0 mm 2.1 mm nt 6.4 mm 3.1 mm thick film noise suppression and filtering components standard suffix for special requirement dimension and circuit configuration resistance tolerance design configuration common code r/c standard combination dt 3.2 mm 1.6 mm chip rc networks resistance value configuration capacitance value configuration ? ? 220 pf to 1000 pf available for ezant, 22 pf to 100 pf available for ezast, ezadt 22 pf 47 pf 100 pf 220 pf 470 pf 1000 pf explanation of part numbers ezact (r/c standard combination) ezact ezadt ezass ezant (r/c except the standard combination) ezastb (r/c standard combination) ezadt ezast ezant (r/c standard combination) feb. 2006
chip rc networks design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. gnd electrode (outer) marking protective coating alumina substrate electrode (outer) gnd electrode (outer) 33 gnd electrode (outer) marking protective coating alumina substrate electrode (outer) gnd electrode (outer) gnd electrode (outer) marking protective coating alumina substrate electrode (outer) gnd electrode (outer) r1 c1 r2 c2 r3 r4 c3 c4 10 9 8 7 2345 6 1 r1=r2=r3=r4 c1=c2=c3=c4 gnd gnd r1 c1 r2 c2 r3 r4 c3 c4 10 9 8 7 23 4 5 6 1 gnd gnd r1=r2=r3=r4 c1=c2=c3=c4 11 12 gnd electrode (outer) marking protective coating alumina substrate electrode (outer) gnd electrode (outer) 33 e 1 z 2 a 3 s 4 s 5 b 6 7 7 0 8 1 9 a 10 j 11 12 ssb j 5% 4.0 mm 2.1 mm thick film noise suppression and filtering components suffix for special requirement dimension and circuit configuration resistance tolerance design number common code convex terminal type chip rc networks resistance value : 10 to 100 k capacitance value : 10 pf to 180 pf in above-mentioned range, it is possible to choose optional r/c. gnd electrode (outer) marking protective coating alumina substrate electrode (outer) r1 r2 r3 r4 c1 c2 c3 c4 10 9 8 7 gnd gnd 2345 6 1 r1=r2=r3=r4 c1=c2=c3=c4 explanation of part numbers ezassb (r/c except the standard com bi na tion) construction circuit con? guration ezact ezadt ezast/ss ezant ezastb/ssb ezact ezadt ezast/ss ezant ezastb/ssb feb. 2006
chip rc networks design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. 0.2 0.1 0.33 0.10 0.40 0.15 0.635 0.100 3.20 0.15 6 1 45 23 87 10 9 1.60 0.15 0.65 0.40 0.15 0.45 0.15 0.35 0.15 0.35 0.10 + 0.20 0.10 33 0.25 0.20 0.5 0.2 0.5 0.2 0.8 0.1 4.0 0.2 6 1 45 23 87 10 9 2.1 0.2 0.65 0.20 0.10 + 0.4 0.2 0.45 0.20 0.5 0.2 0.4 0.2 0.65 0.20 1 0.8 0.2 1.27 0.10 6.4 0.2 45 23 87 10 9 0.25 0.20 3.1 0.2 6 0.5 0.2 0.9 0.2 0.55 0.20 0.80 + 0.20 0.10 0.75 0.20 12 34 5 6 12 11 10 9 8 7 2.2 0.2 0.25 0.15 0.58 0.2 4.0 0.2 0.65 0.20 0.10 + 0.35 0.20 0.3 0.2 0.275 0.200 0.100 + 0.2 0.2 0.1 + 0.4 0.2 0.65 0.10 33 45 6 1 23 0.5 0.1 2.0 0.1 0.20 0.15 0.30 0.15 0.25 0.15 87 10 9 1.25 0.10 0.25 0.15 0.40 0.15 0.40 0.15 0.55 0.10 dimensions in mm(not to scale) ezact ezadt size : 0805 inches mass (weight) [1000 pcs.] :4 g size : 1206 inches mass (weight) [1000 pcs.] :11 g ezast/ss ezant size : 1608 inches mass (weight) [1000 pcs.] :17 g size : 2512 inches mass (weight) [1000 pcs.] :55 g ezastb/ssb size : 1608 inches mass (weight) [1000 pcs.] :18 g feb. 2006
chip rc networks design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. frequency (hz) attenuation (db) attenuation (db) frequency (hz) frequency (hz) frequency (hz) attenuation (db) attenuation (db) 1m 10m 100m 1g 0 10 20 30 40 50 60 70 80 0 10 20 30 40 50 1m 10m 100 m 1 g 3g 100m 3g 1g 10m 1m 1m 10m 100m 1g 3g 0 10 20 30 40 50 10 0 ?0 ?0 ?0 ?0 ?0 100 /10pf 100 /2 2pf 100 /22pf 10 0 / 100 pf 10 0 /47p f 1k /3 30 pf 1k / 1000 pf 100 / 100 pf 100 /22pf 100 /4 7pf measurement circuit ~ 50 50 ezact ezadt ezast ezastb ezant 100 80 60 40 20 0 30 01020304 0506 0708090 ambient temperature ( c) rated load (%) 70 c 85 c 20 10 attenuation characteristics ezact ezst ezastb ezadt (1) for resistors operated in ambient temperature above 70 ?, rated power shall be derated. (?ower derating curve is shown b elow) (2) rated voltage for resistor shall be determined from rated power resistance value, or limiting element voltage (max. rated continuous working v oltage) whichever less. (3) in measuring at 1 mhz, capacitance and dissipation factor are different. ratings po w er derating curve for resistors operated in ambient temperatures above 70 ?, power rating shall be derated in accordance with the ? gure on the right. item speci? cation resistor resistance values 10 to 100 k ezac standard : 10 , 22 , 47 , 100 , 220 , 470 , 1 k ezad/s/n standard : 22 , 47 , 100 , 220 , 470 , 1 k resistance tolerance ? % t emperature coef? cient of resistance (t.c.r.) ?00 10 ? /?(ppm/?) rated power ezac : 0.031 w( < 70 ? (1) ) ezad/s/n : 0.063 w( < 70 ? (1) ) limiting element voltage (maximum rated continuous working voltage) 25 v (2) capacitor capacitance values (25 ?, 1 khz (3) , 1 vrms) ezac : 10 pf to 33 pf standard : 10 pf, 22 pf ezad : 10 pf to 100 pf ezas : 10 pf to 180 pf standard : 22 pf, 47 pf, 100 pf ezan : 220 pf to 1000 pf standard : 220 pf, 470 pf, 1000 pf capacitance tolerance +30 %/?0 % capacitance temperature characteristics e characteristic: +20 %/?5 %(?5 to +85 ?) dissipation factor less than 3 %(25, 1 khz (3) , 1 vrms) rated voltage ezac, ezad : 12 v ezas : 25 v ezan : 50 v category temperature range (operating temperature range) ?5 ? to +85 ? ezant feb. 2006
chip rc networks design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. t t a p 0 p 2 p 1 f d 0 b f w e f d 1 (only emboss) t f c f b w f a carrier tape (unit : mm) (unit : mm) t aping reel pa c kaging methods (taping) standard quantity t ype a b w f e p 1 p 2 p 0 f d 0 t f d 1 ezact 1.65 ?.15 2.40 ?.20 8.00 ?.20 3.50 ?.05 1.75 ?.10 4.00 ?.10 2.00 ?.05 4.00 ?.10 1.50 +0.10 0.85 ?.05 ezadt 2.00 ?.20 3.60 ?.20 ezast/ss 2.50 ?.20 4.40 ?.20 12.00 ?.30 5.50 ?.20 1.75 ?.20 1.15 ?.20 1.50 +0.10 ezastb/ssb ezant 3.50 ?.20 6.80 ?.20 1.30 ?.20 ?0 ?0 t ype f a f b f cw t ezact 180.0 ?.0 60 min. 13.0 ?.0 9.0 ?.0 11.4 ?.0 ezadt ezast/ss 13.0 ?.0 15.4 ?.0 ezastb/ssb ezant t ype kind of taping pitch (p 1 ) quantity ezact punched carrier taping 4 mm 5000 pcs./reel ezadt ezast/ss embossed carrier taping 4000 pcs./reel ezastb/ssb ezant +0 feb. 2006
chip rc networks design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. gnd c f2 f1 a e d b p land pattern solder resistant gnd f2 f1 a p c db land pattern land pattern p b f a g c d f a g c d p b land pattern e a h g c p b d land pattern recommended land pattern design ezast/ss ezact ezastb/ssb ezant design to make gnd pattern as large as possible, because high frequency noise is removed from gnd terminals of chip rc network. abcd dimensions (mm) 1.2 to 1.4 0.4 3.1 to 3.3 0.4 to 0.5 ef1f2p dimensions (mm) 0.8 2.9 to 3.3 4.8 to 5.2 0.8 abcd dimensions (mm) 0.75 0.25 1.70 0.35 ehgp dimensions (mm) 1.85 2.60 0.25 0.60 abcd dimensions (mm) 1.4 to 1.6 0.35 0.45 0.3 f1 f2 p dimensions (mm) 2.7 to 3.5 3.8 0.65 abcd dimensions (mm) 2.3 to 2.5 0.4 to 0.6 5.6 to 5.8 0.4 to 0.8 fgp dimensions (mm) 4.3 to 4.7 7.6 to 8.0 1.27 ezadt abcd dimensions (mm) 0.9 to 1.1 0.2 to 0.3 2.6 to 2.8 0.3 to 0.4 fgp dimensions (mm) 2.0 to 2.6 3.6 to 4.2 0.635 feb. 2006
chip rc networks design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. preheating peak heating temperature time recommended soldering conditions recommendations and precautions are described below. the following are precautions for individual products. please also refer to the precautions common to emi filters, fuses, and sensors(mr elements) shown on page ex2 of this catalog. 1. t ake measures against mechanical stress during and after mounting of chip rc networks (hereafter called the rc networks) so as not to damage their electrodes and protective coatings. be careful not to misplace the rc networks on the land patterns. otherwise, solder bridging may occur. 2. do not use halogen-based or other high-activity ? ux. otherwise, the residue may impair the rc networks' performance and/or reliability. 3. perform suf? cient preheating so that the difference of the solder temperature and the rc networks chip surface temperature becomes 100 c or less. maintain the temperature difference within 100 c during rapid cooling by immersion into solvent after soldering. 4. when soldering with a soldering iron, never touch the rc networks' bodies with the tip of the soldering iron. when using a soldering iron with a high temperature tip, ? nish soldering as quickly as possible (within three seconds at 350 c max.). 5. as the amount of applied solder becomes larger, the mechanical stress applied to the rc networks increases, causing problems such as cracks and faulty characteristics. avoid applying an excessive amounts of solder. 6. do not apply shock to the rc networks or pinch them with a hard tool (e.g. pliers and tweezers). otherwise, the rc networks' protective coatings and bodies may be chipped, affecting their performance. 7. avoid excessive bending of printed circuit boards in order to protect the rc networks from abnormal stress. 8. the static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to dielectric materials having a high dielectric constant. safety precautions flow soldering we do not recommend ? ow soldering to the prod uct, because solder bridging may occur due to the narrow pitch of the terminals and the characteristics of the product may be badly affected when using adhesive to af? x it to a circuit board. recommended soldering conditions for re? ow ? e? ow soldering shall be performed a maximum of two times. please contact us for additional information when used in conditions other than those speci? ed. please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore actual use. for soldering (example : sn/pb) te mperature time preheating 140 ? to 160 ? 60 s to120 s main heating above 200 ? 30 s to 40 s peak 235 ?5 ? max. 10 s te mperature time preheating 150 ? to 180 ? 60 s to 120 s main heating above 230 ? 30 s to 40 s peak max. 260 ? max. 10 s this product has circuits on both sides. therefore, do not use adhesives because they may impair the products characteristics. for lead-free soldering (example : sn/ag/cu) feb. 2006
? ex2 ? safety precautions (common precautions for emi filters, fuses, and sensors[mr elements]) when using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the speci? cations with us in advance. the design and speci? cations in this catalog are subject to change without prior notice. do not use the products beyond the speci? cations described in this catalog. this catalog explains the quality and performance of the products as individual components. before use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signi? cant dam age, such as damage to vehicles (automobile, train, vessel), traf? c lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ? systems equipped with a protection circuit and a protection device ? systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault (1) precautions for use these products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. av equipment, home electric appliances, of? ce equipment, information and communication e quipment) these products are not intended for use in the following special conditions. before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. in liquid, such as water, oil, chemicals, or organic solvent 2. in direct sunlight, outdoors, or in dust 3. in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 4. electric static discharge (esd) environment these components are sensitive to static electricity and can be damaged under static shock (esd). please take measures to avoid any of these environments. smaller componen ts are more sensitive to esd environment. 5. electromagnetic environment avoid any enviro nment wher e strong electromagnetic waves exist. 6. in an environment where these products cause dew condensation 7. sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials these products generate joule heat when energized. carefully position these products so that their heat will not affect the other components. carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. do not mount or place heat-generating components or in? ammables, such as vinyl-coated wires, near these products (except thermal cutoffs). note that non-cleaning solder, halogen-based highly active ? ux, or water-soluble ? ux may deteriorate the performance or reliability of the products. carefully select a ? ux cleaning agent for use after soldering. an unsuitable agent may deteriorate the performance or reliability. in particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. otherwise, the insulation performance may be deteriorated. (2) precautions for storage the performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 c to 35 c and a relative humidity of 45 % to 85 %. (micro chip fuses: guaranteed for 6 months from the date of arrival at your company) the performance of emi filters is guaranteed for 6 months or a year from the out go ing inspection date indicated on the packages, provided that they are stored at a temperature of -5 c to +40 c and a relative humidity of 40 % to 60 %. check the guarantee period in the speci? cations. the performance of thermal cut offs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 c to +40 c and a relative humidity of 30 % to 75 %. even within the above guarantee periods, do not store these products in the following conditions. otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. in salty air or in air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 2. in direct sunlight package markings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english. feb. 2006
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